1、The design describes the structure of compound die stamping flip-chip design and working process.
本次設(shè)計闡述了沖壓倒裝復(fù)合模的結(jié)構(gòu)設(shè)計以及工作過程。

2、In addition, both the working process of compound die and questions required attention are stated.
同時也闡述了復(fù)合模工作過程及注意事項。

3、The structure and machining process of plane diffluent compound die are introduced.
介紹了平面分流組合模的結(jié)構(gòu)和加工工藝。

4、Belling-cold Extrusion Compound Die Design of Locating Ring Boss
鎖扣凸臺的壓凸—冷擠復(fù)合模設(shè)計

compound die翻譯